Current/peak current: 70A*4/90A*4 BEC: None Scable=25 Firmware: AM32/ESCape32 option Work temperature: -20°C to 115°C PCB fabric: 8 Layers 3OZ Extra Copper Weight: 26.8g Firmware: AM32_NEUTRON_4IN1_F421/NEUTRON1 Signal protocol: Dshot 150/300/600/PWM MCU:AT32F421G8U7 Input Voltage: DC 9-60V (3-12S LIPO) Telemetry Signal: Supported Hole Size: 30.5*30.5mm, M4 Cooling mode: extra copper air cooling Size: 42*44*8mm Capacitor : 14PCS 10uF/50V MLCC Voltage/Current : Bus current sensor An external solder copper plate enhances heat dissipation. The solder copper plate is directly soldered to the PCB using the SMT process, with a thermal conductivity of 400-480W/m.k. Common thermal grease bonding has a thermal conductivity of 5-10W/m.k. The thermal conductivity difference between the two bonding methods is 40 times or more. The 8S version uses silver-plated brass, while the 12S version uses gold-plated brass. Colors are used to identify voltage versions.
